Product details

C195 etching IC led Lead Frame to an integrated circuit chip carrier, is a by means of a bonding material (gold, aluminum, copper) to achieve chip internal circuit leads to the side and the outer lead electrical connection, the key structural member forming an electrical circuit, which playrole as a bridge and external wire connection, most of the semiconductor Manifold leadframe is an important base material in the electronic information industry. Product Type TO, DIP, ZIP, SIP, SOP, SSOP, TSSOP, QFP (QFJ), SOD, SOT, etc.. Main production mold stamping method and chemical etching.

C195 etching IC led Lead Frame use of raw materials: KFC, 194,7025, FeNi42, TAMAC-15, PMC-90, etc.. The choice of material is primarily based on the performance of the product requires: (strength, electrical properties and thermal properties) to select.select.

IC C195 etching IC led Lead Frame are precision components, its raw material requirements of the plates is relatively high, especially in the composition of the alloy, plate flatness, thickness tolerance, legacy stress elimination as well as the the slitting accuracy requirements more strict. Therefore, to find a way out on the development of high-performance composite materials.

C195 etching IC led Lead Frame copper alloy materials will be developed in three directions. One is to improve the CA194, making it a tensile strength up 57Kg/rain, conductivity of more than 70% IACS, the heat resistance of 100 "C higher than conventional materials, a copper alloy. Second bending is to improve the KLF copper alloy and after bending resiliency so that it can be used for a QFP lead frame developer outlet of the smaller expansion coefficient of the high-strength copper alloy material., KLF125, EFFEC75X, etc., in order to reduce the wafer due to the stress generated rupture. to an integrated circuit chip carrier, is a by means of a bonding material (gold, aluminum, copper) to achieve chip internal circuit leads to the side and the outer lead electrical connection, the key structural member forming an electrical circuit, which playrole as a bridge and external wire connection, most of the semiconductor Manifold leadframe is an important base material in the electronic information industry. Product Type TO, DIP, ZIP, SIP, SOP, SSOP, TSSOP, QFP (QFJ), SOD, SOT, etc.. Main production mold stamping method and chemical etching.

C195 etching IC led Lead Frame use of raw materials: KFC, 194,7025, FeNi42, TAMAC-15, PMC-90, etc.. The choice of material is primarily based on the performance of the product requires: (strength, electrical properties and thermal properties) to select.select.

IC C195 etching IC led Lead Frame are precision components, its raw material requirements of the plates is relatively high, especially in the composition of the alloy, plate flatness, thickness tolerance, legacy stress elimination as well as the the slitting accuracy requirements more strict. Therefore, to find a way out on the development of high-performance composite materials.

C195 etching IC led Lead Frame copper alloy materials will be developed in three directions. One is to improve the CA194, making it a tensile strength up 57Kg/rain, conductivity of more than 70% IACS, the heat resistance of 100 "C higher than conventional materials, a copper alloy. Second bending is to improve the KLF copper alloy and after bending resiliency so that it can be used for a QFP lead frame developer outlet of the smaller expansion coefficient of the high-strength copper alloy material., KLF125, EFFEC75X, etc., in order to reduce the wafer due to the stress generated rupture.