Product details

 Ni-Ag Chemical Etching

Ni-Ag (nickel-silver) is a Copper-Nickel-Zinc alloy. While the material contains no actual silver, the name "Nickel-Silver" is derived from the materials nickel content and silver appearance. Ni-Ag etching is commonly used in applications that would otherwise require tin-plated copper, such as shielding and covers to provide RF / EMI protection to electronic components. Because of material´´´´´´´´´´´´´´´´s ability to be soldered without any additional plating, it can offer significant cost savings.

Ni-Ag C770 Material Composition (Main Elements):

Typical Grades:

• C770
• C752

Common Uses:

• RF/EMI Shielding
• Covers
• Filters

Advantages:

• Solder-ability
• Ductility for Forming

Please note that the above figures are given as a guideline. Should your component design fall outside these parameters please talk to one of our Technical Sales team who will be happy to talk through you requirement. Email: yw1@zldsmt.com

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